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Intel Unveils Groundbreaking EUV Tool

Technological Breakthrough in Chip Manufacturing Intel Foundry has achieved a significant milestone by completing the assembly of the industry’s first High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) lithography tool at its D1X fab in Oregon. This development is crucial as Intel prepares for research and development for its 14A process scheduled for 2025. Utilizing ASML’s Twinscan EXE:5000 machine places Intel at the forefront of chip manufacturing technology, surpassing competitors like TSMC.

Enhanced Capabilities and Cost Concerns The High-NA tool allows Intel to fabricate significantly smaller transistors, improving transistor density by up to 290%. However, this technology comes with concerns about high costs, especially since Intel previously decided not to use Low-NA technology for its 10nm process. Despite past difficulties with yields and delays, Intel is committed to adopting the latest technologies to avoid past mistakes and maintain its competitive edge.

Promising Future with High-NA EUV Technology Looking ahead, Intel plans not only to develop its 14A node using this new tool but also to be among the first to adopt ASML’s second-generation Twinscan EXE:5200B system, promising even more efficient production. With plans already underway for three generations of High-NA machines, Intel aims to ensure its leadership in technological innovation in chip manufacturing.