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New MCU Technologies at Embedded World

Embedded World 2024: A Look at Microcontroller Innovations

Innovation and Technology Hub in Europe This year marks the 22nd edition of Embedded World, regarded as the main gathering for the European embedded community, but its influence spans globally. This year’s event attracted 1,100 exhibitors from nearly 50 countries and 32,000 visitors from around 80 countries, highlighting “the significance of Embedded World as the key meeting place for the embedded community,” as stated by event director Benedikt Weyerer at the show’s conclusion.

Significant Advancements in Microcontrollers Microcontrollers remain the cornerstone of the embedded industry, providing the essential building blocks for any design. EE Times Europe spoke with three MCU companies that announced new products at Embedded World 2024. A highlighted topic was the new low-latency Bluetooth Channel Sounding, enhancing ranging applications. Sujata Neidig, marketing director for wireless connectivity at NXP Semiconductors, discussed the launch of their new series of wireless MCUs, the MCX W series, which is the first wireless MCU to support Bluetooth Channel Sounding.

Product Launches and Updates The MCX W achieves an accuracy of ±0.5 meters using time-of-flight and round-trip phase ranging modes, with a rapid response time thanks to a dedicated on-chip localization compute engine accelerator that keeps latency below 10 ms. Additionally, it features a 2.4-GHz 802.15.4 radio subsystem based on an Arm Cortex-M3 with a power amplifier and a low-noise amplifier, freeing the main Arm Cortex-M33 core from running wireless stacks.

On another front, Microchip launched its new AVR DU family of 8-bit USB MCUs, notable for their up to 15 W power delivery capability, ideal for USB-C charging and rechargeable toys. This series also incorporates a security feature that disables the program and debug interface to protect against malicious attacks.

Focus on the Matter Standard Lastly, Matt Maupin from Silicon Labs discussed the xG26 series, which focuses on meeting the growing demand for Matter-based connectivity. These devices are designed to facilitate system integration and offer enhanced performance with an integrated AI/ML accelerator, preparing developers for future updates and security features.